HP OMEN 16t

HP OMEN MAX 16T Ai Ultra 9-275HX 64GB 2TB NVME 16 WUXGA 165HZ RTX 5090 24GB WIN 11 HOME SHADOW BLACK Processor (CPU): Intel® Core™ Ultra 9 275HX Cores / Threads: 24 Cores / 24 Threads Clock Speed: Up to 5.4 GHz Max Turbo Frequency Cache: 36 MB L3 Cache AI Processing: Integrated Intel® AI Boost NPU (13 NPU TOPS) Graphics (GPU): NVIDIA® GeForce RTX™ 5090 Laptop GPU Video Memory: 24 GB GDDR7 Dedicated VRAM TGP (Total Graphics Power): Peak performance up to 175W Architecture Features: Blackwell architecture, DLSS 4/4.5, and Reflex 2 Memory (RAM): 64 GB DDR5-5600 MHz Configuration: Dual-channel layout (2 x 32 GB) Expandability: 2 accessible SODIMM slots (upgradable up to 64GB) Storage: 2 TB PCIe® Gen4 NVMe™ Performance M.2 SSD Display & Visuals Size: 16.0-inch diagonal Resolution: WUXGA (1920 x 1200) Refresh Rate: 165 Hz Panel Type: IPS, anti-glare, micro-edge border Brightness: 400 nits Eye Care: Low Blue Light certified Connectivity & Ports Wireless: Intel® Wi-Fi 7 BE200 (2×2) or Wi-Fi 6E AX211, Bluetooth® 5.4 / 5 Left Side I/O: 2 x Thunderbolt™ 4 with USB Type-C® (40Gbps, USB Power Delivery, DisplayPort™ 2.1, HP Sleep and Charge) 1 x 3.5mm Headphone/Microphone combo jack Right/Rear I/O: 2 x USB Type-A 3.2 Gen 2 (10Gbps signaling rate, 1 supports Sleep and Charge) 1 x HDMI 2.1 1 x RJ-45 Ethernet port 1 x AC Smart Pin power connector Design, Audio, & Power Chassis Material & Color: Premium aluminum frame finished in Shadow Black Keyboard: Full-size, per-key RGB backlit keyboard with numerical pad, integrated HyperX wireless receiver Thermal Design: OMEN Tempest Cooling Pro system with metal liquid compound and dust-preventing self-cleaning fans Audio: Dual speakers tuned by HyperX, DTS:X® Ultra support, HP Audio Boost Battery: 6-cell, 83 Wh Li-ion polymer battery Power Supply: 330W AC Power Adapter Dimensions: 356.6 x 268.9 x 22.9–24.9 mm (14.04″ x 10.59″ x 0.90–0.98″) Weight: ~2.69 kg – 2.72 kg (approx. 5.9 – 6.0 lbs) Hybrid Formula: The OMEN Cryo Compound mixes liquid metal properties with standard paste materials to prevent the severe leaking and electrical short risks associated with pure liquid metal. Application: Applied directly to internal processors (CPU and GPU) under the cooling vapor chamber or heat sink in specialized configurations. [ Risks of Pure Liquid Metal: Standard pure liquid metal is electrically conductive and highly corrosive to aluminum. Unofficial or improper aftermarket applications can leak past foam barriers, leading to catastrophic motherboard shorts. 1 year warranty